Dowstone Technology's Subsidiary to Strategically Invest USD 30 Million in Brain Family Inc.

Source: China Securities News·China Securities Network

China Securities News (Wang Luo)Dow TechnologyRecently, an announcement was made stating that its holding subsidiary, Hong Kong Jiana Co., Ltd., has signed a "Pre-B Round Preferred Stock Subscription Agreement" with BrainCo, a global leader in brain-computer interface technology. According to the agreement, Hong Kong Jiana will invest 30 million US dollars of its own funds to subscribe for BrainCo’s Pre-B round preferred stock, thereby acquiring a minority stake.

The announcement shows that BrainCo, as a global leading brain-computer interface technology company, has a core team mainly composed of graduates from top world universities such as Harvard University and MIT. The company has obtained more than 460 authorized patents, and its core products have passed multiple international authoritative certifications such as FDA and CE. Commercial applications have been widely used in many high-value fields including medical rehabilitation, educational technology, consumer health, and human-computer interaction.

The pricing of this subscription is based on the characteristics of BrainCo's industry, its R&D capabilities, future potential, and the valuation by other investors in the Pre-B round, as determined through negotiation. The preferred shares obtained by Hong Kong Jiana have priority rights over common shares in terms of liquidation, voting, and repurchase, and can be converted into common shares at a ratio of 1:1.

Dow Technology stated that this investment aims to seize the opportunities of the AI era, leverage the company's experience in the materials field, collaborate with BrainCo to enhance the "AI + Materials" layout, and utilize its application experience in brain-computer interface technology to strengthen ecological empowerment and commercial implementation capabilities. Meanwhile, it will also promote the application of carbon materials in areas such as electronic skin to enhance core competitiveness.